Title:
MOLDING METHOD, MOLDING DIE, INSERT PIN, MOLDED COMPONENT, AND COMPONENT
Document Type and Number:
Japanese Patent JP2008238637
Kind Code:
A
Abstract:
To provide a shaping method of an assembly component capable of manufacturing the component efficiently, increasing mechanical strength and small-sizing the component, a molding die, an insert pin used for the shaping mold, a molding component molded with the molding die and a component.
The molding die 40 in which the insert pin 31 can be inserted has the first die 41 supporting the insert pin 31 in the lengthwise direction of the insert pin 31 and the second die 45 supporting the insert pin 31 in the direction perpendicular to the lengthwise direction of the insert pin 31, and clamps the insert pin 31 with the first die 41 and the second die 45.
Inventors:
INATOMI TAKASHI
Application Number:
JP2007083699A
Publication Date:
October 09, 2008
Filing Date:
March 28, 2007
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B29C33/14; B29C45/14
Attorney, Agent or Firm:
Masahiko Ueyanagi
Fujitsuna Hideyoshi
Kazuhiko Miyasaka
Fujitsuna Hideyoshi
Kazuhiko Miyasaka
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