Title:
フィルムコンデンサの成形方法およびその成形型枠
Document Type and Number:
Japanese Patent JP7175721
Kind Code:
B2
Abstract:
To improve the molding efficiency and prevent the capacitor element unit from floating during resin injection in a molding method of the capacitor element unit in a cantilever-supported state of lying sideways.SOLUTION: There is provided a molding method in which the outer periphery of a capacitor element unit 2 is covered with an exterior resin 5 while an external connection terminal 4 is exposed. The capacitor element unit 2 is laid sideways in a cavity 14 of a molding frame B, and then the capacitor element unit 2 is cantilevered on the side wall of the molding frame B at the external connection terminal 4. When a molten resin 5a is injected into the cavity 14 by restricting the upward direction with respect to the free end side portion 2a on the side opposite to the external connection terminal 4 in the capacitor element unit 2, the outer circumference of the capacitor element unit is covered with the molten resin while the position of the capacitor element unit 2 is restricted from being lifted by the buoyancy of the molten resin to maintain the horizontal posture.SELECTED DRAWING: Figure 4
Inventors:
Kohei Kitagawa
Application Number:
JP2018212035A
Publication Date:
November 21, 2022
Filing Date:
November 12, 2018
Export Citation:
Assignee:
Nichicon Co., Ltd.
International Classes:
H01G4/32; B29C33/12; B29C39/10; B29C39/24; B29C39/26; H01G13/00
Domestic Patent References:
| JP6238680A | ||||
| JP2002217056A |
Foreign References:
| WO2018074138A1 |
Attorney, Agent or Firm:
Kazuhide Okada
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