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Title:
MOLDING METHOD OF HOLLOW BODY, HOLLOW BODY USING THIS MOLDING METHOD, AND HOLLOW BODY RECEPTACLE
Document Type and Number:
Japanese Patent JP2009040026
Kind Code:
A
Abstract:

To provide a molding method of a hollow body in which a hollow body such as a corrugated cardboard made of a resin or the like is processed so that the recess is a steep edge and the circumference section is even.

The molding method of a hollow body which forms a recess 19 at the surface of a resin hallow body 10 which has many hollow parts 18 in the inside includes: the half-cut step in which a cutter 24 which has a cutting edge corresponding to a recess is pushed into a thickness direction to a first depth from the surface to thereby separate a domain 13 corresponding to a recess from the circumference; and the pressing step in which a pressing body 26 is pressed into a thickness direction from the surface to the second depth of the domain corresponding to the recess separated from the circumference to thereby form a recess in which the domain corresponding to a recess of the hollow body is crushed in a thickness direction.


Inventors:
TAOKA TSUGUTOSHI
Application Number:
JP2007269043A
Publication Date:
February 26, 2009
Filing Date:
October 16, 2007
Export Citation:
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Assignee:
SANKO SOKEN KK
International Classes:
B31B1/74; B29C53/06; B65D25/02; B65D77/04; B29L24/00
Domestic Patent References:
JP2007055633A2007-03-08
JPS4829594A1973-04-19
JPH0858000A1996-03-05
JPS5180489A1976-07-14
JP2007022598A2007-02-01
JP2002326476A2002-11-12
JP2006256694A2006-09-28
Attorney, Agent or Firm:
Samejima Mutsumi
Kyousei Tamura
Kitahara Yasuhiro