MOLDING METHOD

Japanese Patent JP3286490

B2

PURPOSE: To prevent the leakage of a resin and the generation of burr without complicating the structure of a mold by introducing a curable resin to which predetermined energy is preliminarily applied into a cavity and making the pressure in the cavity by the introduced resin larger than the pressure at the time of the introduction of the resin to cure the resin in the cavity.
CONSTITUTION: A curable resin 4 to which predetermined energy is preliminarily applied is introduced into a cavity 3 and by making the pressure in the cavity by the introduced resin larger than the pressure at the time of the introduction of the resin, the curable resin 4 in imperfectly cured to be brought to a gel state. By this method, curing shrinkage quantity is reduced and, by applying pressure to the resin corresponding to the shrinkage quantity at the time of perfect curing, the lowering of accuracy caused by curing shrinkage can be prevented. Further, by adjusting the flowability of the resin 4, the leakage of the resin and the generation of burr can be prevented and the handling properties of the resin 4 can be enhanced and the structure of molds 1, 2 can be simplified.

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Wataru Ohtani

JP5544295A

May 27, 2002

March 15, 1995

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株式会社リコー

B29C35/02; B29C39/02; B29C39/22; B29C39/44; B29C43/02; B29C43/52; B29C69/02; B29K101/10; B29K105/20; B29K105/24; B29L11/00; (IPC1-7): B29C39/02; B29C35/02; B29C39/22; B29C39/44

JP62144914A
JP6313721A
JP1198312A
JP768568A
JP3256019A
JP68252A
JP81807A
JP62258401A

Gunichiro Ariga

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