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Title:
MOLDING FOR PHOTOSENSITIVE MATERIAL AND PHOTOSENSITIVE MATERIAL PACKAGE USING THE SAME
Document Type and Number:
Japanese Patent JP2003241346
Kind Code:
A
Abstract:

To obtain a lightweight foamed molding for photosensitive material which has superior size precision without any deterioration in photographic property by using paper resin of (51:49) to (75:25) in the constitution ratio of cellulose fiber sourced from paper and fully thermoplastic resin and efficiently foaming the paper resin having more nonfoamed components than resin components contributing to foaming.

The molding for photosensitive material is characterized in that paper resin pellets which are of (51:49) to (75:25) in the constitution mass ratio of the cellulose fiber derived from paper and the fully thermostatic resin and contain at least one kind of dispersion improving agent are used and supercritical fluid is mixed with resin in a cylinder to carry out a foaming injection molding.


Inventors:
ENOMOTO MASAHIRO
Application Number:
JP2002046311A
Publication Date:
August 27, 2003
Filing Date:
February 22, 2002
Export Citation:
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Assignee:
FUJI PHOTO FILM CO LTD
International Classes:
G03C3/00; B65D1/00; B65D1/09; B65D81/107; B65D81/30; B65D85/67; (IPC1-7): G03C3/00; B65D1/09; B65D81/107; B65D81/30; B65D85/67
Attorney, Agent or Firm:
Yasuhiro Noguchi