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Patent Searching and Data


Title:
MOLDING POLYACRYLONITRILE COMPOSITION
Document Type and Number:
Japanese Patent JPS6092349
Kind Code:
A
Abstract:

PURPOSE: To provide the titled compsn. which can be easily molded, is not discolored during heating, gives moldings having excellent heat resistance, etc. and is suitable for use in the production of gas barrier film, etc., by blending a dimethylformamide/boron trifluoride complex with polyacrylonitrile.

CONSTITUTION: 5W50pts.wt. dimethylformamide/boron trifluoride complex is blended with 100pts.wt. polyacrylonitrile to obtain the desired molding polyacrylonitrile compsn. By this blending, the intermolecular cohesive force of polyacrylonitrile is relaxed to thereby facilitate molding and further polyacrylonitrile can be prevented from being discolored by an intramolecular cyclization reaction during heating. The dimethylformamide/boron trifluoride complex is present in the form of a white powder at room temp. and can be obtd. by adding an equimoler amount of boron trifluoride to dimethylformamide.


Inventors:
SHIOBARA TOMOO
ABE HIROSHI
Application Number:
JP19975083A
Publication Date:
May 23, 1985
Filing Date:
October 25, 1983
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08K3/38; C08K5/20; C08K13/02; C08L33/00; C08L33/02; C08L33/18; C08L33/20; (IPC1-7): C08K3/38; C08K5/20; C08K13/02; C08L33/20