Title:
MOLDING STRUCTURE AND METHOD FOR MANUFACTURING MOLDING STRUCTURE
Document Type and Number:
Japanese Patent JP2021112827
Kind Code:
A
Abstract:
To provide a molding structure capable of suppressing the generation of warpage and the generation of unevenness in an outer shape, and a method for manufacturing the same.SOLUTION: A pillar garnish 20 comprises: a tabular substrate body part 31 containing a fiber and a thermoplastic resin; and a resin molding 40 containing a thermoplastic resin, arranged in at least a part of the surroundings of the substrate body part 31, and joined with the substrate body part 31. A substrate sub-body part 32 containing a fiber and a thermoplastic resin is embedded inside the resin molding 40.SELECTED DRAWING: Figure 1
Inventors:
MARUYAMA SHINTARO
Application Number:
JP2020005000A
Publication Date:
August 05, 2021
Filing Date:
January 16, 2020
Export Citation:
Assignee:
TOYOTA BOSHOKU CORP
International Classes:
B29C45/14; B29C33/12; B29C43/34; B29C45/26; B29C70/18; B29C70/42; B60R13/02
Attorney, Agent or Firm:
Akatsuki Joint Patent Office