Title:
MOTHERBOARD PRINTED WIRING BOARD AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JP3147113
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To reduce stresses due to the difference in thermal expansion coefficient between a BGA semiconductor package and a motherboard printed wiring board.
SOLUTION: A motherboard printed wiring board is provided with an insulating layer 9, which is formed by a build-up method on an insulating substrate 12 and BGA pad portions of a motherboard on the insulating layer 9, of which a BGA semiconductor package 5 equipped with one or plural chips on its surface is mounted. In this case, the BGA pad portions have resin 7 shaped like protrusions. Resin having low modulus of elasticity is used as the resin 7. The protrusions are formed higher than the surrounding insulating layer by about 20-40 microns.
Inventors:
Yasuji Furui
Application Number:
JP8573999A
Publication Date:
March 19, 2001
Filing Date:
March 29, 1999
Export Citation:
Assignee:
NEC
International Classes:
H05K3/34; H01L21/60; H05K1/18; H05K3/46; (IPC1-7): H05K3/34; H01L21/60; H05K1/18; H05K3/46
Domestic Patent References:
| JP10256712A | ||||
| JP637456A |
Attorney, Agent or Firm:
Yoshiyuki Iwasa