To improve heat conduction efficiency without increasing component/assembly costs when a heat insulation material is disposed between a mount support section and a mount ring.

In a mount structure, a mount includes: a mount support section 2 which is a part of a camera body 8 and is composed of a heat transfer material thermally connected to an image pickup device 1; a mount ring 4 capable of being engaged to a lens; a non-heat transfer material interposed between the mount support section 2 and the mount ring 4; and a metallic mount spring 5 which is interposed between the mount ring 4 and the non-heat transfer material and includes an annular section brought into contact with the mount ring 4 and a lens spring section 5a formed on the inner peripheral side to be brought into pressure contact with a lens mount pawl section. The mount includes a portion where the mount spring 5 and the mount support section 2 are brought into pressure contact with each other across the non-heat transfer material.