Title:
MOUNTING ASSEMBLY APPARATUS FOR FPD AND MOUNTING ASSEMBLY METHOD
Document Type and Number:
Japanese Patent JP2011232696
Kind Code:
A
Abstract:
To prevent the reduction in productivity associated with a switching of a product type by allowing compatibility between a full pressure-bonding unit and a PCB unit, each having an especially long process time and a strong tendency to define an entire tact.
A mounting assembly apparatus comprises a PCB unit 140 that is switchable between a PCB connecting unit and an OLB full pressure-bonding unit according to a design of a FPD panel P to be produced. The PCB unit 140 can be switched to a full pressure-bonding unit 130 by switching an operation mode. Accordingly, the reduction in productivity on switching a product type of the FPD panel P is prevented.
Inventors:
DAIROKU NORIYUKI
ONOSHIRO ATSUSHI
KATO HARUYOSHI
ICHIKAWA HISAYOSHI
HIWATARI SHOTARO
ONOSHIRO ATSUSHI
KATO HARUYOSHI
ICHIKAWA HISAYOSHI
HIWATARI SHOTARO
Application Number:
JP2010105414A
Publication Date:
November 17, 2011
Filing Date:
April 30, 2010
Export Citation:
Assignee:
HITACHI HIGH TECH CORP
International Classes:
G09F9/00; G02F1/1345; H01L21/60
Attorney, Agent or Firm:
Shunji Kagei
Kagei Keidai
Kagei Keidai
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