Title:
実装基板及び実装基板の製造方法
Document Type and Number:
Japanese Patent JP6972829
Kind Code:
B2
Abstract:
To provide a mounting substrate which suppresses occurrence of a position deviation of an element, and a manufacturing method for them.SOLUTION: A mounting substrate 1 comprises: a housing substrate 10 that includes a first surface 11 and a second surface 12 positioned on the side opposite to the first surface, in which a convex part 13 is provided onto the first surface side, and that includes an organic material; an element 50 that is positioned in a concave part of the housing substrate, and includes a terminal; an insulation layer 20 that at least partially covers the hosing substrate and the element in the first surface side, and is partially positioned in at least gap between a wall surface of the concave part of the housing substrate and the element; and a conductive layer 25 including a first part 26 positioned on the insulation layer and a second part 27 that penetrates the insulation layer and electrically connects a first part to the terminal of the element.SELECTED DRAWING: Figure 1
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Inventors:
Kuramochi Satoru
Application Number:
JP2017181413A
Publication Date:
November 24, 2021
Filing Date:
September 21, 2017
Export Citation:
Assignee:
Dai Nippon Printing Co.,Ltd.
International Classes:
H01L23/12; H01L25/04; H01L25/18
Domestic Patent References:
| JP2004165194A | ||||
| JP2005006279A | ||||
| JP2013197136A |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Yukihiro Hotta
Kazuo Okamura
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Yukihiro Hotta
Kazuo Okamura
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