Title:
実装装置
Document Type and Number:
Japanese Patent JP6881995
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a mounting device which can ensure the mounting quality to increase the productivity in laminating and mounting a plurality of kinds of semiconductor chips on a substrate.SOLUTION: Provided is a mounting device comprising: a substrate supplying part for supplying a substrate; a chip supplying part for supplying a semiconductor chip; a stage for holding the substrate; a plurality of mounting parts each including a combination of bonding heads for heat-press bonding the semiconductor chip; a substrate-withdrawing part for withdrawing a substrate with the semiconductor chip mounted thereon by the mounting part; substrate transporting means for transporting the substrate; and a transportation control part for controlling the substrate transport means. The mounting parts are disposed in a plurality of positions. The transportation control part selects, of the plurality of mounting parts, which mounting part to transport a substrate supplied from the substrate supplying part to.SELECTED DRAWING: Figure 1
Inventors:
Koji Nishimura
Takashi Haru
Samurai Matsumoto
Mikio Kawakami
Takashi Haru
Samurai Matsumoto
Mikio Kawakami
Application Number:
JP2017022275A
Publication Date:
June 02, 2021
Filing Date:
February 09, 2017
Export Citation:
Assignee:
Toray Engineering Co., Ltd.
International Classes:
H01L21/60; H01L25/065; H01L25/07; H01L25/18; H05K13/04; H05K13/08
Domestic Patent References:
| JP2014017313A | ||||
| JP10163274A | ||||
| JP2016086084A | ||||
| JP2012209300A | ||||
| JP2013055171A | ||||
| JP2012234899A |
Foreign References:
| WO2014068664A1 |