Title:
MOUNTING DEVICE AND MOUNTING METHOD
Document Type and Number:
Japanese Patent JP2023106662
Kind Code:
A
Abstract:
To provide a mounting device and a mounting method capable of realizing high accuracy mounting in which a mounting accuracy becomes 1 μm or less in a face-down mounting for mounting a chip component and a substrate in a manner that both of electrode surfaces face each other.SOLUTION: A mounting device comprises: an attachment tool having transparency and having a tool recognition mart, for holding a chip component; chip position recognition means for acquiring position information on a chip recognition mark and the tool recognition mark at the same time in a state where the chip component is held by the attachment tool; and substrate position recognition means for acquiring the position information on a substrate recognition mark and the tool recognition marl. On the basis of information obtained by the chip position recognition means and the information obtained by the substrate position recognition means, the substrate stage or the attachment tool is moved in a substrate inner surface direction and positioning of the chip component and the substrate is performed. A mounting method is also provided.SELECTED DRAWING: Figure 1
Inventors:
AOKI SHIMPEI
HARAI TAKASHI
HAMAKAWA KENJI
TERADA KATSUMI
HARAI TAKASHI
HAMAKAWA KENJI
TERADA KATSUMI
Application Number:
JP2022007513A
Publication Date:
August 02, 2023
Filing Date:
January 21, 2022
Export Citation:
Assignee:
TORAY ENG CO LTD
International Classes:
H01L21/60; H05K13/04
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