Title:
実装装置
Document Type and Number:
Japanese Patent JP7320721
Kind Code:
B2
Abstract:
To further improve a mounting speed in a mounting operation.SOLUTION: A mounting device 1 has a first mobile unit 3 and a first mobile device 2 moving the first mobile unit 3 along a first direction. The first mobile unit 3 has a second mobile unit 5 and a second mobile device 4 moving the second mobile unit 5 along a second direction. At least one of the first mobile device 2 and the second mobile device 4 has linear type motors 21 and 41. The linear type motors 21 and 41 have coil blocks 22 and 42 each including a coil, and magnet blocks 23 and 43 including a permanent magnet applying magnetic force with the coil in a state where exciting current is made to flow. The permanent magnet is arranged in a Halbach array.SELECTED DRAWING: Figure 1
Inventors:
Hiroshi Okamura
Application Number:
JP2019103341A
Publication Date:
August 04, 2023
Filing Date:
May 31, 2019
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H02K41/03; H05K13/04
Domestic Patent References:
| JP2019075467A | ||||
| JP2018113749A | ||||
| JP2009005562A |
Foreign References:
| US6313551 | ||||
| KR1020130034818A | ||||
| DE102015222677A1 |
Attorney, Agent or Firm:
Hokuto Patent Attorneys Office
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