Title:
MOUNTING METHOD AND APPARATUS OF CONDUCTIVE BALL
Document Type and Number:
Japanese Patent JP3770496
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an improved mounting method and an apparatus for mounting conductive balls on an arranged object so as to form a predetermined arranging pattern.
SOLUTION: The mounting method for mounting conductive balls on one surface of an arranged object so as to form a predetermined arranging pattern has: a first step for positioning an aligning member that has one surface and the other surface opposed to the one surface, and an opening that is formed corresponding to the pattern, opens toward the one surface and the other surface, and allows the balls to penetrate therein, to the state that the other surface faces the one surface of the arranged object; and a second step for horizontally moving a shaking insertion tool that has two or more linear members arranged in a state that their axial cores are roughly aligned, and is arranged in a state that the linear members can abut in almost horizontal postures to the balls fed to the one surface of the aligning member.
Inventors:
Motomichi Ito
Masanori Ochiai
Shinichi Wai
Masanori Ochiai
Shinichi Wai
Application Number:
JP2004062505A
Publication Date:
April 26, 2006
Filing Date:
March 05, 2004
Export Citation:
Assignee:
Hitachi Metals Co., Ltd.
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP2002171054A | ||||
| JP2002151539A | ||||
| JP2001244288A | ||||
| JP2001118496A | ||||
| JP9293753A |