To provide a mounting method and a mounting apparatus for an electronic component that improve mechanical connection strength of the electronic component to achieve improvement in reliability.
The mounting method for the electronic component includes: mounting the electronic component 16 on a wiring pattern of a printed circuit board 10; filling a bonding material 20 containing a thermosetting resin and magnetic powder 22 into at least between the printed circuit board and electronic component and around the electronic component, heating and curing the bonding material thereby bonding the electronic component to the printed circuit board with the bonding material; and during the curing of the bonding material by heating, disposing the printed circuit board mounted with the electronic component between electromagnets 52a, 52b arranged opposite each other and applying magnetic force to the bonding material, and controlling a dispersion state of the magnetic powder in the bonding material with magnetic force.
| JPH09266229A | 1997-10-07 | |||
| JPH10107082A | 1998-04-24 | |||
| JP2008159624A | 2008-07-10 | |||
| JPH09162229A | 1997-06-20 | |||
| JP2000294601A | 2000-10-20 | |||
| JPH10112477A | 1998-04-28 |
Satoshi Kono
Makoto Nakamura
Yoshihiro Fukuhara
Takashi Mine
Toshio Shirane
Sadao Muramatsu
Nobuhisa Nogawa
Kocho Chojiro
Naoki Kono
Katsu Sunagawa
Katsumura Hiro
Shoji Kawai
Tatsushi Sato
Takashi Okada
Mihoko Horiuchi
Takenori Masanori
Takuzo Ichihara
Yamashita Gen