PURPOSE: To efficiently and accurately screen print solder paste for mounting an electronic component such as various chip component, a surface mounting IC, etc., on a board on the board, and to accurately mount the component on the board.
CONSTITUTION: An aiming point of an aligning mark 2 is brought into coincidence with a reference point of an aligning hole to a board 1 formed with a connecting conductor pattern and the mark 2 by using a printing screen formed with an aligning hole which can transparently observe the mark 2, the screen is superposed, and solder paste is screen printed. Thereafter, the position of the paste 30 corresponding to the aligning hole, printed to be superposed on the mark is detected, the position of a mounting head for holding the board 1 or an electronic component, and is corrected to mount the component at a designated position on the board.
KOBAYASHI MASAYOSHI
TAKANO MASATO
