Title:
MOUNTING METHOD FOR FLIP CHIP
Document Type and Number:
Japanese Patent JPH0737935
Kind Code:
A
Abstract:
PURPOSE: To prevent a decrease in reliability of a bonding portion due to stresses occurred by a thermal shock in a mounting method for flip chip used in various electronic equipment.
CONSTITUTION: An Au electrode 3 is formed on an aluminum electrode 2 on a flip chip 1, is aligned with conductor wiring 4 formed on an insulating body 6, and the Au electrode 3 and the conductive wiring 4 are bonded together with a metal bonding material comprising a 3.5% Ag and a 96.5% Sn5.
Inventors:
AZUMA KAZUJI
SHIMAZAKI SHINJI
SHIMAZAKI SHINJI
Application Number:
JP17638793A
Publication Date:
February 07, 1995
Filing Date:
July 16, 1993
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/60; H05K1/18; (IPC1-7): H01L21/60; H05K1/18
Attorney, Agent or Firm:
Yoshihiro Morimoto
Next Patent: ADHERING DEVICE FOR ANISOTROPIC CONDUCTIVE SHEET