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Patent Searching and Data


Title:
MOUNTING OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH03161995
Kind Code:
A
Abstract:

PURPOSE: To restrain the temperature rise of an IC, and obtain a superior state of solder reflow, by surface treating the rear of an IC provided with a solder bump by using heat reflecting material, and performing reflow by heating using far-infrared ray radiating method.

CONSTITUTION: An IC 12 provided with a solder bump whose rear is subjected to surface treatment by using heat reflecting material 13, e.g. white siver paste, is mounted on a substrate 11, which is mounted on a belt 14. By moving the belt 14 with a belt driving body 15, the IC 12 provided with the solder bump is carried in a reflow furnace. Three far-infrared heaters 21, 22, 24 are arranged in the upper part of the belt type reflow furnace. Two far-infrared heaters 23, 25 are arranged in the lower part of the furnace. Each of the heaters 21-25 is set at an individual specified temperature.


Inventors:
UTASHIRO HIDEKAZU
Application Number:
JP30082589A
Publication Date:
July 11, 1991
Filing Date:
November 21, 1989
Export Citation:
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Assignee:
OKI ELECTRIC IND CO LTD
International Classes:
H05K3/34; H01L21/60; (IPC1-7): H01L21/60; H05K3/34
Attorney, Agent or Firm:
Mamoru Shimizu (1 person outside)