Title:
電子部品の実装構造、及び電子部品の実装方法
Document Type and Number:
Japanese Patent JP5326625
Kind Code:
B2
Inventors:
Yukihiro Hashi
Application Number:
JP2009029089A
Publication Date:
October 30, 2013
Filing Date:
February 10, 2009
Export Citation:
Assignee:
Seiko Epson Corporation
International Classes:
H03H9/09; H01L23/02; H03H3/02; H03H9/02; H03H9/10; H05K1/18; H05K3/32; H05K3/34
Domestic Patent References:
| JP8065093A | ||||
| JP10173006A | ||||
| JP8316764A | ||||
| JP3003396A | ||||
| JP2007208470A | ||||
| JP2005101527A | ||||
| JP2007019410A | ||||
| JP4293310A | ||||
| JP5129370A | ||||
| JP6283951A | ||||
| JP8078830A | ||||
| JP8078856A | ||||
| JP8107323A | ||||
| JP2001292048A | ||||
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| JP2008282902A |
Foreign References:
| WO2006025139A1 |
Attorney, Agent or Firm:
Masatake Shiga
Kazunori Onami
Kazunori Onami