Title:
Mounting structure of electronic parts
Document Type and Number:
Japanese Patent JP6265459
Kind Code:
B2
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Inventors:
Kobayashi Chizen
Satoshi Sasaki
Satoshi Sasaki
Application Number:
JP2013052697A
Publication Date:
January 24, 2018
Filing Date:
March 15, 2013
Export Citation:
Assignee:
OMRON Automotive Electronics Co., Ltd.
International Classes:
H01L25/07; H01F27/22; H01F30/10; H01L23/40; H01L25/18; H05K7/20
Domestic Patent References:
| JP5166646A | ||||
| JP2007305809A | ||||
| JP2002281758A | ||||
| JP2006288052A |
Attorney, Agent or Firm:
Hideyuki Okumura