Title:
MOUNTING STRUCTURE OF HEATING COMPONENT AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2017162994
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a mounting structure of a heating component which allows for efficient dissipation of heat generated from a high heating component, such as an LED chip, and to provide a manufacturing method thereof.SOLUTION: In a mounting structure of a heating component 101 being bonded to a circuit board 102 via a bonding member 103, the circuit board includes a heat dissipation metal body 108, an insulator 107 formed on the heat dissipation metal body, and a substrate electrode 106 formed on the insulator facing the component electrode of the heating component. Out of the substrate electrodes of the circuit board, at least one substrate electrode has an opening 106a, a part of the heat dissipation metal body is exposed at the opening, and the component electrode facing the substrate electrode having an opening is bonded to both the substrate electrode having the opening and the heat dissipation metal body exposed at the opening, via the bonding material.SELECTED DRAWING: Figure 1A
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Inventors:
MIYAKE TAKAHIRO
TSUKAHARA NORITO
HIRANO MASATO
TSUKAHARA NORITO
HIRANO MASATO
Application Number:
JP2016046198A
Publication Date:
September 14, 2017
Filing Date:
March 09, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H01L33/64; H01L33/62
Domestic Patent References:
| JP2005038892A | 2005-02-10 | |||
| JP2005340233A | 2005-12-08 | |||
| JP2003258415A | 2003-09-12 | |||
| JPH1131876A | 1999-02-02 |
Foreign References:
| WO2011036277A1 | 2011-03-31 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Samejima Mutsumi
Hiroshi Okabe
Mitsuo Wada
Samejima Mutsumi
Hiroshi Okabe
Mitsuo Wada