Title:
Mounting structure of integrated circuit elements
Document Type and Number:
Japanese Patent JP6327233
Kind Code:
B2
Inventors:
Toshiyuki Nakaiso
Ozawa Shindai
Ozawa Shindai
Application Number:
JP2015215127A
Publication Date:
May 23, 2018
Filing Date:
October 30, 2015
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K1/18; H03H7/01; H03H7/075
Domestic Patent References:
| JP2002026230A | ||||
| JP2001307948A | ||||
| JP2002314028A | ||||
| JP2011077004A |
Attorney, Agent or Firm:
Kaede International Patent Office
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