Title:
MOUNTING STRUCTURE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2003158225
Kind Code:
A
Abstract:
To solve the problem that, when the conventional method in which a BGA is preformed in an IC package or on a printed circuit board is used, the IC package or printed circuit board is apt to be damaged thermally, because the package or circuit board must be heated for melt-sticking solder balls to junction terminals and, in addition, the package or board must be reheated for melting the solder balls into molten solder at mounting.
The IC package and printed circuit board are soldered by using a mounting structure provided with a polymer substrate having through holes at the positions corresponding to the arranged junction terminals and a solder composition packed in the through holes.
Inventors:
OHAMA SATOSHI
ENDOU KIYOHITO
YAMAMOTO SHUHEI
ENDOU KIYOHITO
YAMAMOTO SHUHEI
Application Number:
JP2001358939A
Publication Date:
May 30, 2003
Filing Date:
November 26, 2001
Export Citation:
Assignee:
SEIKO INSTR INC
OPUTEKU KK
OPUTEKU KK
International Classes:
H05K3/34; H01L23/32; H05K1/18; (IPC1-7): H01L23/32; H05K1/18; H05K3/34
Attorney, Agent or Firm:
Masaaki Sakagami
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