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Title:
MOUNTING STRUCTURE, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2009117496
Kind Code:
A
Abstract:

To provide a mounting structure wherein a joint material portion is hardly broken by thermal stress in product environment.

A protruded electrode (4) of an electronic component is embedded and electrically connected into a conductor wire (2) provided on a base material (1). The conductor wire has at least a porous portion (2a) around the protruded electrode.


Inventors:
IMAMURA HIROYUKI
MORIKAWA MAKOTO
NISHIWAKI KENTARO
YANO KAORI
Application Number:
JP2007286840A
Publication Date:
May 28, 2009
Filing Date:
November 05, 2007
Export Citation:
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Assignee:
PANASONIC CORP
International Classes:
H05K3/32; H01L21/60; H05K1/02
Domestic Patent References:
JPH06209151A1994-07-26
JP2006202604A2006-08-03
JP2001203229A2001-07-27
JPS5234049U1977-03-10
JP2005051204A2005-02-24
JPS5714470U1982-01-25
Foreign References:
WO2006033402A12006-03-30
WO2001086716A12001-11-15
Attorney, Agent or Firm:
Yoshihiro Morimoto
Toshiji Sasahara
Yohei Harada



 
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