Title:
高周波回路部品の実装構造、実装方法及び実装装置
Document Type and Number:
Japanese Patent JP4166035
Kind Code:
B2
Abstract:
By mounting electronic circuit components using a microstrip line, transmission loss and variation in performance are reduced. At least one projection of substantially uniform height is provided on each of four side surfaces of the components. The components are disposed on the chassis by bringing their projections into contact with adjacent circuit components. A heat-resistant film or a heat-resistant tape is adhered to one or both side surfaces of adjacent side surfaces of the components, to dispose the components in contact with each other. A component-mounting nozzle is used to adsorb the components, and position them on the chassis in contact with a guide fitted on the chassis or in the vicinity of the chassis. It is also possible to position the components with actuators located around the chassis, after the components are provisionally disposed on the chassis with the component-mounting nozzle.
Inventors:
Toyama Yukio
Yasunari Hara
Tsuguhisa Ishii
Katsuoka Ritsu
Shinji Sakamoto
Yasunari Hara
Tsuguhisa Ishii
Katsuoka Ritsu
Shinji Sakamoto
Application Number:
JP2002135901A
Publication Date:
October 15, 2008
Filing Date:
May 10, 2002
Export Citation:
Assignee:
Fujitsu Ten Co., Ltd.
International Classes:
H05K7/04; H05K7/20; H01P5/00; H05K9/00; H05K13/00
Domestic Patent References:
| JP5920733Y1 | ||||
| JP4919260U | ||||
| JP4932560U | ||||
| JP52155954U | ||||
| JP2001326306A |
Attorney, Agent or Firm:
Takashi Ishida
Jun Tsuruta
Shigeru Tsuchiya
Masaya Nishiyama
Higuchi Souji
Jun Tsuruta
Shigeru Tsuchiya
Masaya Nishiyama
Higuchi Souji