To reduce stresses applied to an electrode pad for a circuit board through pressure loading by mounting facedown a semiconductor element on the circuit board, in which a bump is formed onto the electrode pad for the circuit board through the use of a connecting material such as gold, solder, etc., by a wire bumping method.

A bump 1 is formed onto an electrode pad 2 for a circuit board 3 through a wire bumping method by employing an electrical connecting material such as gold, solder, etc., and the upper section of the circuit board 3 is filled with an anisotropic conductive encapsulating resin 4. The mean value and dispersion of the contact area of the electrode pad 2 for the circuit board 3 and the bump 1 depend upon the ball shape of wire bumping and the contact area of the electrode pad 2 for the circuit board 3 at that time. An electrode pad 6 for a semiconductor element 5 is loaded at the specified place of the bump 1 on the circuit board 3, while being pressed facedown. The bump 1 is plastically deformed at the time of the contact of the electrode pad 6 for the semiconductor element 5 and the bump 1, and the dispersion in height can be absorbed at that time.