Title:
MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2550879
Kind Code:
B2
Abstract:
PURPOSE: To enable high density mounting of a surface mount semiconductor device, facilitate its mounting, and obtain a mounting structure wherein heat dissipating effect is increased.
CONSTITUTION: First and second semiconductor devices 10, 20 which are mounted on a circuit board 1 in the multilayered state have flat packages 11, 21. A plurality of lead terminals 12, 22 are protruded from the one side of the packages and protrusions 13, 23 are collectively arranged on the lower surfaces of the packages. In the first semiconductor device 10 of the lower side, the lead terminals 12 are connected with the circuit board 1 in the state that the protrusion 13 is made to abut against the upper surface of the circuit board 1. In the second semiconductor device 20 of the upper side, the lead terminals 22 are connected with the circuit board 1 on the opposite side of the lead terminals of the first semiconductor device, in the state that the protrusion 23 is made to abut against the upper surface of the first semiconductor device package.
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Inventors:
AIBA MASATO
Application Number:
JP23078593A
Publication Date:
November 06, 1996
Filing Date:
August 25, 1993
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L23/50; H01L25/10; H01L25/11; H01L25/18; H05K1/18; H05K3/34; (IPC1-7): H01L25/10; H01L23/50; H01L25/11; H01L25/18
Domestic Patent References:
| JP6127258U | ||||
| JP6345006Y2 |
Attorney, Agent or Firm:
Suzuki Akio