Title:
Mounting structure to the heat sink of a luminescent device and a luminescent device
Document Type and Number:
Japanese Patent JP5919387
Kind Code:
B2
Abstract:
A light-emitting apparatus has a substrate (72) having a generally disc shape, a light-emitting part (76) having a plurality of LED chips (73) mounted on one main surface of the substrate (72), the plurality of LED chips (73) being sealed with a resin (74), and a heat-sink attachment part having a heat-sink attachment male thread (80) formed on a side surface of the substrate (72). When the attachment area of the substrate (72) to the heat sink is kept the same, the light-emitting part (76) may be enlarged, and when the light-emitting unit (76) is kept the same, the attachment area of the substrate (72) may be reduced.
Inventors:
Toshio Hata
Makoto Agata
Tomokazu Nada
Yusuke Fujita
Yamaguchi Ippei
Masahiro Konishi
Makoto Agata
Tomokazu Nada
Yusuke Fujita
Yamaguchi Ippei
Masahiro Konishi
Application Number:
JP2014542092A
Publication Date:
May 18, 2016
Filing Date:
October 10, 2013
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L33/64; F21V19/00; F21V23/00; F21V23/06; F21V29/503; F21V29/70; H01L23/40
Domestic Patent References:
| JP2012079855A | 2012-04-19 | |||
| JP2007227422A | 2007-09-06 | |||
| JP2011009298A | 2011-01-13 | |||
| JP2005513815A | 2005-05-12 | |||
| JP3131092U | 2007-04-19 | |||
| JP2008293753A | 2008-12-04 | |||
| JP2012079855A | 2012-04-19 | |||
| JP2007227422A | 2007-09-06 |
Attorney, Agent or Firm:
Mitsuo Tanaka
Hiroshi Yamazaki
Etsuko Isoe
Toshiyuki Yamazaki
Hiroshi Yamazaki
Etsuko Isoe
Toshiyuki Yamazaki
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