Title:
MOUNTING SUBSTRATE FOR BGA PACKAGE
Document Type and Number:
Japanese Patent JP3643656
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To eliminate the need of soldering again even when defective soldering occurs.
SOLUTION: Through hole 40 having solder sumps which are formed by increasing at least the diameter are formed in the middle sections of through holes which are formed through a mounting substrate 20 between the front and rear surfaces of the substrate 20 at the positions where the terminals 11 of a BGA package (electronic package of an IC, etc., having ball grid electrodes) 10 come into contact. Therefore, the workability of the mounting work of the package 10 on the substrate 20 can be improved, because, even when defective soldering is found after the package 10 is mounted on the substrate 20, the defective soldering can be corrected without removing the package 10 even when the defective soldering is found after the package 10 is mounted on the substrate 20.
Inventors:
Tadashi Arakawa
Application Number:
JP25512396A
Publication Date:
April 27, 2005
Filing Date:
September 26, 1996
Export Citation:
Assignee:
Buffalo Co., Ltd.
International Classes:
H01L21/60; H05K3/34; H05K1/11; (IPC1-7): H01L21/60; H01R12/32; H05K3/34
Domestic Patent References:
| JP57186067U | ||||
| JP61050390U | ||||
| JP7211744A | ||||
| JP63093124A | ||||
| JP8125325A | ||||
| JP7007258A | ||||
| JP57020500A | ||||
| JP58169996A |
Attorney, Agent or Firm:
Toshiyuki Yokoi
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