Title:
MOUNTING SUBSTRATE AND METHOD FOR JUDGING RESIN POSITION
Document Type and Number:
Japanese Patent JP2004207360
Kind Code:
A
Abstract:
To enable confirmation of displacement of resin supplied on a substrate in the mounting process including the process to temporarily fix electronic components on the substrate with resin.
When an electronic component is temporarily fixed by previously forming a confirmation mark 2 to confirm the resin position on the substrate 1, the resin R is supplied on the confirmation mark 2 to obtain a difference between the position of resin R supplied actually and the position of confirmation mark 2 formed on the substrate 1. Accordingly, displacement of resin R is visually confirmed immediately.
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Inventors:
YASUDA MASAO
Application Number:
JP2002372347A
Publication Date:
July 22, 2004
Filing Date:
December 24, 2002
Export Citation:
Assignee:
SHARP KK
International Classes:
H05K3/34; H05K1/02; (IPC1-7): H05K1/02; H05K3/34
Attorney, Agent or Firm:
Yoshiro Kurauchi
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