Title:
MOUNTING-SUBSTRATE PRODUCTION SYSTEM
Document Type and Number:
Japanese Patent JP3391039
Kind Code:
B2
Abstract:
PURPOSE: To minimize the time to the final product and to realize the efficient production by linking a plurality of devices in parallel in the conveying direction of substrates, and providing the constitution wherein the substrates can be conveyed to any device from the device in previous step.
CONSTITUTION: Individual steps are connected so that a substrate can be conveyed between arbitrary devices between the previous and succeeding steps with a substrate conveying device 15 in the group of the devices for constituting the steps for solder printing, part mounting and soldering indicated by A1-D3. Thus, the mounting-substrate production system is constituted. In the mounting- substrate production system, at least any devices for the solder printing step, the part mounting step and the soldering step are arranged in parallel. Therefore, even if the case wherein required parts or printing plates are present after the change in kind of a machine in any of the devices which are arranged in parallel has occurred, it is not necessary to replace the parts of the device and to replace the printing plate, or the number of the replacements can be decreased.
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Inventors:
Yasuhiro Maenishi
Masayuki Kajiyama
Masayuki Kajiyama
Application Number:
JP3307093A
Publication Date:
March 31, 2003
Filing Date:
February 23, 1993
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K3/34; H05K13/04; (IPC1-7): H05K3/34; H05K13/04
Domestic Patent References:
| JP4348855A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)
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