Title:
半導体ウエハ処理中におけるエッジ処理制御のための可動式エッジ連結リング
Document Type and Number:
Japanese Patent JP6783521
Kind Code:
B2
Abstract:
An edge ring arrangement for a processing chamber includes a first ring configured to surround and overlap a radially outer edge of an upper plate of a pedestal arranged in the processing chamber, a second ring arranged below the first moveable ring, wherein a portion of the first ring overlaps the second ring, a first actuator configured to actuate a first pillar to selectively move the first ring to a raised position and a lowered position relative to the pedestal, and a second actuator configured to actuate a second pillar to selectively move the second ring to a raised position and a lowered position relative to the pedestal.
Inventors:
Hao Quang Yang
Robert Griffith O'Neill
Rafael Casaes
John McKezney
Alex patterson
Robert Griffith O'Neill
Rafael Casaes
John McKezney
Alex patterson
Application Number:
JP2016004302A
Publication Date:
November 11, 2020
Filing Date:
January 13, 2016
Export Citation:
Assignee:
LAM RESEARCH CORPORATION
International Classes:
H01L21/3065; H01L21/02; H01L21/205; H01L21/265; H01L21/31; H01L21/683
Domestic Patent References:
| JP2012216614A | ||||
| JP2001192834A | ||||
| JP7221024A | ||||
| JP2001329370A | ||||
| JP2001230239A | ||||
| JP9162258A | ||||
| JP2008300387A | ||||
| JP2012222235A | ||||
| JP2013058766A | ||||
| JP2001525997A |
Attorney, Agent or Firm:
Meisei International Patent Office