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Title:
MOVING MECHANISM
Document Type and Number:
Japanese Patent JP2011173220
Kind Code:
A
Abstract:

To provide a moving mechanism, in which it is prevented that a motive load bends thin setae, causing the thin setae to interfere with each other, leading to the deviation from the ideal adhesive condition, which results in the decrease of adhesive force, and thereby moving capability is maintained.

The contact surface of the moving mechanism is provided with an adhesive element, in which a plurality of the thin setae are regularly arranged with a first pitch in a first direction inclined by a first angle with respect to the moving direction, and regularly arranged with a second pitch in the second direction inclined by a second angle, larger than the first angle, with respect to the moving direction. When the first angle is α, the first pitch is p1, the width of the cross section in a direction substantially perpendicular to the bending direction of the thin setae is d, by satisfying formula 3: α≥2×sin-1((d/2)/p1), the moving mechanism is provided in which it is prevented that a motive load bends the thin setae, causing the thin setae to interfere with each other, leading to the deviation from the ideal adhesive condition, which results in the decrease of adhesive force, and thereby moving capability is maintained.


Inventors:
WADA SHIGERU
KAMIYAMA MASAYUKI
URATANI KATSUICHI
Application Number:
JP2010039813A
Publication Date:
September 08, 2011
Filing Date:
February 25, 2010
Export Citation:
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Assignee:
KONICA MINOLTA HOLDINGS INC
International Classes:
B25J7/00; B25J5/00; B60B9/02



 
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