Title:
Multi-MEMS module
Document Type and Number:
Japanese Patent JP6350667
Kind Code:
B2
Abstract:
A multi-MEMS module is specified which can be produced expediently and enables a smaller design. The module comprises a housing having an interior and a first and a second opening, a first MEMS chip and a second MEMS chip. The first MEMS chip is acoustically coupled to the first opening. The second MEMS chip is acoustically coupled to the second opening.
Inventors:
Pearl, Wolfgang
Fayerturk, Gregor
Fayerturk, Gregor
Application Number:
JP2016545860A
Publication Date:
July 04, 2018
Filing Date:
December 04, 2014
Export Citation:
Assignee:
tdk Corporation
International Classes:
H04R19/04; B81B7/02; H04R1/02; H04R1/40
Domestic Patent References:
| JP2007104556A | ||||
| JP2012506211A |
Foreign References:
| US20120250897 | ||||
| US20100086146 |
Attorney, Agent or Firm:
Fukami patent office
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