Title:
マルチセル電子回路配列及び製造方法
Document Type and Number:
Japanese Patent JP5320493
Kind Code:
B2
Abstract:
A method for fabricating a multi-cell electronic circuit array and exemplary multi-cell electronic circuit arrays are disclosed. In one embodiment, a multi-cell electronic circuit array includes an elongate substrate having a linear array of first electronic cell components micro fabricated thereon. The elongate substrate is inserted into a tubular enclosure which has at least one second electronic cell component which interacts with the first electronic cell components.
Inventors:
Jacobsen, Stephen Sea
Smith, fraser
Churun, Shane
Oliver,mark
Smith, fraser
Churun, Shane
Oliver,mark
Application Number:
JP2012147073A
Publication Date:
October 23, 2013
Filing Date:
June 29, 2012
Export Citation:
Assignee:
RAYTHEON COMPANY
International Classes:
H01J11/18; H01J9/02; H01J9/395; H01J11/22; H01J11/32; H01J11/34; H01J11/36; H01J11/38; H01J11/42; H01J17/49
Domestic Patent References:
| JP2000315460A | ||||
| JP2003272561A | ||||
| JP200386141A | ||||
| JP2002216523A | ||||
| JP2005285437A |
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Hiroyuki Tomita
Osamu Hoshino
Hideo Tanaka
Yasushi Kobayashi
Hiroyuki Tomita
Osamu Hoshino
Hideo Tanaka