Title:
MULTI-CHIP MODULE BOARD AND MULTI-CHIP MODULE
Document Type and Number:
Japanese Patent JP2001183556
Kind Code:
A
Abstract:
To provide a multi-chip module board and a multi-chip module unnecessitating to make optical axes of optical wires mutually aligned and capable of being connected even to a bending printed wiring board.
One photoelectric conversion element mounting part is connected to the other photoelectric conversion element part by optical wiring being a continuous body and also the photoelectric transuding element is mounted in the multi-chip module board having an external connecting terminal connected to the electric wring of the photoelectric transuding element mounting part, and the multi-chip module is obtained.
Inventors:
TSUKAMOTO TAKETO
OIDE MASAYUKI
ISHIZAKI MAMORU
SASAKI ATSUSHI
YOTSUI KENTA
ICHIKAWA KOJI
MINATO TAKAO
OIDE MASAYUKI
ISHIZAKI MAMORU
SASAKI ATSUSHI
YOTSUI KENTA
ICHIKAWA KOJI
MINATO TAKAO
Application Number:
JP36972899A
Publication Date:
July 06, 2001
Filing Date:
December 27, 1999
Export Citation:
Assignee:
TOPPAN PRINTING CO LTD
International Classes:
H01L31/12; G02B6/122; G02B6/42; (IPC1-7): G02B6/42; H01L31/12
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