Title:
多層UV硬化性接着剤フィルム
Document Type and Number:
Japanese Patent JP2011516658
Kind Code:
A
Abstract:
This invention is an adhesive film comprising (a) a top layer that is substantially UV curable and that has a glass transition temperature of 50°C or less; and (b) a bottom layer that is substantially not UV-curable. Additional embodiments include a bundled wafer lamination film, a semiconductor wafer with a multilayer adhesive film attached, a process for attaching a semiconductor die to a substrate, and a method of preventing individually diced dies from sticking to one another.
Inventors:
Lee, Byung Chun
Application Number:
JP2011502911A
Publication Date:
May 26, 2011
Filing Date:
March 31, 2008
Export Citation:
Assignee:
HENKEL CORPORATION
International Classes:
C09J7/22; C09J7/38; C09J133/00; C09J163/00; C09J179/04; H01L21/301; H01L21/52
Domestic Patent References:
| JP2005290381A | 2005-10-20 | |||
| JP2003327925A | 2003-11-19 | |||
| JP2007335643A | 2007-12-27 | |||
| JP2003277699A | 2003-10-02 | |||
| JP2006299226A | 2006-11-02 | |||
| JP2006299226A | 2006-11-02 |
Attorney, Agent or Firm:
Katsuhiro Ito
Akiko Ono
Akiko Ono