Title:
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2022174958
Kind Code:
A
Abstract:
To provide a multi-layer ceramic electronic component that, in an external electrode having a Cu plating layer, can suppress, reduction in reliability based on pulling stress remaining in the Cu plating layer.SOLUTION: A multi-layer ceramic capacitor 10A being an example of a multi-layer ceramic electronic component according to the present invention comprises: a laminate 12 in which a plurality of ceramic layers 14 and a plurality of internal electrode layers 16 are laminated; and a pair of external electrodes 30, the external electrodes are electrically connected with the internal electrode layers 16 and formed on one/the other of both end faces of the laminate 12. The pair of external electrodes 30 each has a base electrode layer 32 having a metal component and a ceramic component, and a Cu plating layer 34 arranged on the base electrode layer 32. In the Cu plating layer 34, compression stress is applied to the Cu plating layer 34 arranged on both principal surfaces 12a, 12b and surfaces of both side faces 12c, 12d of the laminate 12. The compression stress is 50 MPa or more and 300 MPa or less.SELECTED DRAWING: Figure 2
Inventors:
ONISHI KOSUKE
KANZAKI TAISUKE
KANZAKI TAISUKE
Application Number:
JP2021081034A
Publication Date:
November 25, 2022
Filing Date:
May 12, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/30
Attorney, Agent or Firm:
Okada
Hajime Ogiya
Hajime Ogiya