To provide a multi-layer hollow molding made of thermoplastic resin which shows outstanding heat resistance, hot water resistance, chemical resistance, antigas hole permeability, tenacity, interlayer adhesive properties or the like, all of these being well-balanced, and further, conductivity.
This multilayer hollow molding is made up of at least, two or more thermoplastic resin layers and at least, one or more adhesive layer, and at least, one layer among the other thermoplastic resin layers is formed of a composition which is composed mainly of a polyphenylene sulfide resin, and at least, one layer of the thermoplastic resin layers is formed of a thermoplastic resin composition which is composed mainly of a thermoplastic resin other than the polyphenylene sulfide resin. In addition, between (A) layer and (B) layer, an adhesive layer which has adhesive properties with the (A) layer and the (B) layer (provided, however, that the main constituent components of the adhesive layer are different from those of the (A) layer and the (B) layer), is present.
SHIMASAKI NORIO
KOBAYASHI SADAYUKI
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