Title:
多層実装MMIC回路
Document Type and Number:
Japanese Patent JP3610715
Kind Code:
B2
Inventors:
Naoyuki Kurita
Kagozaki Keigo
Kagozaki Keigo
Application Number:
JP611597A
Publication Date:
January 19, 2005
Filing Date:
January 17, 1997
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L23/13; H01P3/02; H01P3/08; H01P5/02; H01P5/10; (IPC1-7): H01P5/10; H01L23/13; H01P5/02
Domestic Patent References:
| JP2241102A | ||||
| JP563408A |
Attorney, Agent or Firm:
Yasuo Sakuta