Title:
電動デバイスのための多層表面処理パッド
Document Type and Number:
Japanese Patent JP2013502268
Kind Code:
A
Abstract:
A multi-layer surface treating pad is disclosed. It has an upper layer suitable to serve as one part of a hook/loop type fastener system, a bottom layer which comprises an abrasive or polishing material, and a cleaning or other surface treating formulation positioned between the upper and bottom layer in the form of a bump which is positioned mostly in a central region of the pad. The bump of the formulation causes the upper layer to bulge upwardly so as to provide a visual indication as to where one optimally should attach a motorized device thereto.
Inventors:
Harris, Jennifer, Earl.
Plzeparsniac, Anne Marie
Nopow, Jeremy, F.
Plzeparsniac, Anne Marie
Nopow, Jeremy, F.
Application Number:
JP2012525525A
Publication Date:
January 24, 2013
Filing Date:
August 13, 2010
Export Citation:
Assignee:
S. C. Johnson and Sun, Inc.
International Classes:
A47L13/17; A47L11/03; A47L11/16; A47L13/16; B24B29/00
Domestic Patent References:
| JP2004122337A | 2004-04-22 | |||
| JP2008512143A | 2008-04-24 | |||
| JP2004313552A | 2004-11-11 |
Foreign References:
| WO2008085362A2 | 2008-07-17 |
Attorney, Agent or Firm:
Takahashi Hayashi & Partners