Title:
多層伝送線路板
Document Type and Number:
Japanese Patent JP6645108
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer transmission line plate capable of reducing skew in differential transmission without using a complicated process.SOLUTION: A multilayer transmission line plate comprises a pair of ground layers, a differential wiring arranged between one of the pair of ground layers and the other of the pair of ground layers, an insulating layer I arranged between the differential wiring and the one ground layer, and an insulating layer II arranged between the differential wiring and the other ground layer. At least one of the insulating layer I and the insulating layer II is a layer containing a glass cloth and a resin composition. The difference between a dielectric constant of the glass cloth and a dielectric constant of the resin composition in at least one layer among the layers containing the glass cloth and the resin composition is at most 1.0.SELECTED DRAWING: Figure 3
Inventors:
Yusuke Kondo
Mizuo Etsuo
Takao Tanikawa
Yuki Nagai
Tomio Fukuda
Mizuo Etsuo
Takao Tanikawa
Yuki Nagai
Tomio Fukuda
Application Number:
JP2015199360A
Publication Date:
February 12, 2020
Filing Date:
October 07, 2015
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H05K3/46; B32B7/025; B32B17/04; H05K1/02
Domestic Patent References:
| JP2006232952A | ||||
| JP2009141233A | ||||
| JP200131782A | ||||
| JP200317820A |
Foreign References:
| WO2013012053A1 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kosuke Sawayama
Kenichi Hirasawa
Kosuke Sawayama