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Title:
複層型下敷きテープ
Document Type and Number:
Japanese Patent JP7169574
Kind Code:
B2
Abstract:
To provide an underlay tape with extreme excellency in cut-resistance capable of preventing a builder from applying too much force when cutting.SOLUTION: A multilayer type underlay tape is configured to sandwich a net-shape sheet 4 between an upper layer film 2 and a lower layer film 3 and securely bond the upper layer film 2 and the lower layer film 3 with the net-shape sheet 4 at only both ends thereof. The net-shape sheet 4 is configured to weave a warp 4B generally parallel to a longitudinal direction of the multilayer type underlay tape and a weft 4A generally orthogonal to the warp 4B crossing the multilayer type underlay tape in a width direction. The weft 4A of the net-shape sheet 4 is composed of materials with initial tensile elastic modulus of 290 cN/dtex or more.SELECTED DRAWING: Figure 2

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Inventors:
Akihiro Nakamura
Masayuki Kurita
Application Number:
JP2018220794A
Publication Date:
November 11, 2022
Filing Date:
November 27, 2018
Export Citation:
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Assignee:
Sansho Tsusho Co., Ltd.
Kurita Tobacco Seedling Production Co., Ltd.
International Classes:
E04F21/18; E04F13/07
Domestic Patent References:
JP200419411A
JP2009248250A
JP2016113753A
JP11335942A
JP2011219909A
Attorney, Agent or Firm:
Patent Business Corporation Takahashi International Patent Office