Title:
多層配線基板およびその製造方法
Document Type and Number:
Japanese Patent JP4199198
Kind Code:
B2
Abstract:
A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin composition (12), and an in-core wiring portion (20) which has a laminated structure of at least one insulating layer (21) containing a glass fiber material (21a) and a wiring pattern (22) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion (10). The out-core wiring portion (30) has a laminated structure of at least one insulating layer (31) and a wiring pattern (32) and is bonded to the core portion (100) at the in-core wiring portion (20).
Inventors:
Tomoyuki Abe
Nobuyuki Hayashi
Motoaki Tani
Nobuyuki Hayashi
Motoaki Tani
Application Number:
JP2004566274A
Publication Date:
December 17, 2008
Filing Date:
January 16, 2003
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K3/46; A63H30/04; H01L21/48; H01L23/48; H01L23/498; H05K1/03; H05K3/42
Domestic Patent References:
| JP200487856A | ||||
| JP2000138453A | ||||
| JP7249847A |
Attorney, Agent or Firm:
Minoru Yoshida
Tatsuya Tanaka
Tatsuya Tanaka