Title:
多層配線構造体及びその製造方法
Document Type and Number:
Japanese Patent JP6747467
Kind Code:
B2
Abstract:
Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.
Inventors:
Kuwashima Ichi
Tominaga Nishikawa
Takafumi Otsuka
Takeshi Ohashi
Okuyama Yuichiro
Manabu Yamatani
Tominaga Nishikawa
Takafumi Otsuka
Takeshi Ohashi
Okuyama Yuichiro
Manabu Yamatani
Application Number:
JP2018073953A
Publication Date:
August 26, 2020
Filing Date:
April 06, 2018
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01L21/768; H01L23/522; H05K3/42
Domestic Patent References:
| JP2002118109A | ||||
| JP2000323568A | ||||
| JP10284603A | ||||
| JP2009016782A |
Foreign References:
| US20080000678 |
Attorney, Agent or Firm:
Mitsuhiro Washito
Ogata Japanese
Yasuyuki Kurose
Ogata Japanese
Yasuyuki Kurose