To suppress the displacement of an annular groove against a work and the fluctuation of the groove interval and to uniformly cut the work by providing rising sections suppressing the thermal expansion/shrinkage of a multi-groove cylinder at both end section of the multi-groove cylinder made of a synthetic resin.

The roller main body 13 of a multi-groove roller 3 and a multi- groove cylinder 14 tend to expand in the axial direction by the frictional heat between a semiconductor ingot and wires, the frictional heat between the wires and the multi-groove roller 3, and the heat from a bearing 11 at the time of cutting. The multi-groove cylinder 14 made of a synthetic resin has the linear expansion coefficient five to six times that of the roller main body 13, however the thermal expansion of the multi-groove cylinder 14 is hindered by the action of rising sections 18, 19 provided at both end sections of the multi-groove cylinder 14 and is suppressed nearly within the range of the thermal expansion of the roller main body 13, thereby the wafers polished and cut by the wires guided by the annular grooves of the cylinder 14 can be kept uniform in thickness.