Title:
多層基板およびアンテナ素子
Document Type and Number:
Japanese Patent JP6919731
Kind Code:
B2
Abstract:
The insertion loss of a multilayer substrate and an antenna element is reduced. A multilayer substrate according to an embodiment of the present disclosure includes a multilayer body, a wire conductor, and a first ground electrode. The multilayer body is formed by dielectric layers being layered. The wire conductor is formed in the multilayer body, and a radio frequency signal passes through the wire conductor. The first ground electrode is formed in or on the multilayer body and includes a first surface that faces the wire conductor. The first surface includes a first region and a second region. The surface roughness of the first region is lower than the surface roughness of the second region. The first region overlaps at least part of the wire conductor in plan view in a direction normal to the first ground electrode.
Inventors:
Ariumi Jinsho
Hijiridai Shrine
Suzuki Suzuki
Hijiridai Shrine
Suzuki Suzuki
Application Number:
JP2019568953A
Publication Date:
August 18, 2021
Filing Date:
January 09, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H05K3/38; H01P3/08; H01Q13/08; H05K1/02
Domestic Patent References:
| JP2001210959A | ||||
| JP2016092561A | ||||
| JP61277207A |
Attorney, Agent or Firm:
Fukami patent office