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Title:
MULTILAYER CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2018133355
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a multilayer ceramic electronic component, in a ceramic electronic component, capable of ensuring sufficient strength against stress caused in a direction connecting metal terminals of the ceramic electronic component together.SOLUTION: A multilayer ceramic electronic component 10 is formed by connecting a pair of metal terminals 40A and an electronic component body 12 having a layered body 14 and an external electrode 24 by a joining material 60. Each of the pair of metal terminals 40A comprises a terminal body part 50, an extension part 52, and a mounting part 54. The terminal body part 50 further has side rib portions 56a, 56b extending to face respective side surfaces of the electronic component body 12. The joining material 60 exists between the side rib portions 56a, 56b and the external electrode 24 facing the side rib portions 56a, 56b, but the joining material 60 does not exist between the terminal body part 50 and an end surface central part of the external electrode 24.SELECTED DRAWING: Figure 1

Inventors:
KAMBE SHOGO
ADACHI MASAHIRO
NAKANO KIMISUKE
OTSUKA HIDEKI
Application Number:
JP2017023960A
Publication Date:
August 23, 2018
Filing Date:
February 13, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/232; H01F27/29; H01G4/30
Domestic Patent References:
JPH028125U1990-01-19
JP2016162938A2016-09-05
JP2016225380A2016-12-28
JPH11162780A1999-06-18
JPH11102837A1999-04-13
JP2012023322A2012-02-02
JP2008130954A2008-06-05
JPH09266134A1997-10-07
Foreign References:
WO2016039057A12016-03-17
Attorney, Agent or Firm:
Masahiro Okada
Ichi Ogiya



 
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