Title:
積層セラミック電子部品
Document Type and Number:
Japanese Patent JP7102256
Kind Code:
B2
Abstract:
A multilayer ceramic electronic component includes a multilayer ceramic electronic component body and a pair of metal terminals. The multilayer ceramic electronic component body includes a multilayer body including laminated ceramic layers and inner electrode layers and first and second outer electrodes provided on both end surfaces of the multilayer body. The metal terminals are connected to the outer electrodes. The inner electrode layers are perpendicular or substantially perpendicular to a mounting surface and include extended portions that extend to the end surfaces and portions of the first and second side surfaces. The distance between ends of the first and second outer electrodes on one of the first and second side surfaces is in a range from about 1.8% to about 31.3% of a length dimension of the multilayer ceramic electronic component in a direction connecting both end surfaces of the multilayer ceramic electronic component body.
Inventors:
Masakazu Itamochi
Application Number:
JP2018122473A
Publication Date:
July 19, 2022
Filing Date:
June 27, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/30; H01C7/04; H01F27/02; H01F27/06; H01F27/29; H01G2/02; H01G2/10
Domestic Patent References:
| JP2008153294A | ||||
| JP2004273935A | ||||
| JP627109A | ||||
| JP200225852A | ||||
| JP2016139787A | ||||
| JP2011100830A |
Foreign References:
| CN1707709A | ||||
| WO2017100073A1 |
Attorney, Agent or Firm:
Okada